Thermal Shock Failure Test under Rapid Temperature Changes
Machinable Ceramics: Electrically Conductive Ceramics
✔Suitable for EDM (Electrical Discharge Machining) and Wire-Cut Processing
✔Excellent Resistance to Thermal Shock (Rapid Temperature Fluctuations)
Our specially engineered Silicon Nitride-based machinable ceramic offers outstanding process adaptability, meeting customized manufacturing requirements at the client end with precision and reliability。
Thermal Shock Failure Test of Silicon Carbide (SiC) under Rapid Temperature Changes
Machinable Silicon Carbide (SiC):
✔Excellent Thermal Shock Resistance
✔Acid and Alkali Resistant; Superior Wear Resistance
✔Low Coefficient of Thermal Expansion
Our special-grade Silicon Carbide (SiC) material is a machinable ceramic engineered to meet customized manufacturing process requirements with precision and reliability。
High-Temperature Stickiness and Residue Assessment
Machinable Ceramics: Electrically Conductive Ceramics
✔Compatible with EDM (Electrical Discharge Machining) and Wire-Cut Processing
✔Non-Stick Surface, No Residue After Processing
Our specialized Silicon Nitride-based machinable ceramic is engineered to meet customized manufacturing process requirements, offering high precision and clean processing performance for client-specific applications。
Peel Strength Test：8.01 (lbf/in)
Solder Layer Thickness：0.5 μｍ
High-density copper-clad silicon nitride (Si₃N₄) substrates are highly suitable for high-power and high-voltage PCB applications.。
Our proprietary copper cladding process enables excellent adhesion between the copper foil and the silicon nitride substrate, effectively preventing delamination and significantly improving production yield for downstream manufacturing processes。
By leveraging the wear-resistant properties of high-purity nano powders, we provide an effective solution to severe scratching issues on filament guide components, which previously led to fiber surface damage and fine dust generation. This advancement has successfully helped the chemical fiber industry improve production yield and output quality。
By utilizing ultrafine silicon nitride (Si₃N₄) powder forming technology, we are able to produce materials that withstand rapid high-low temperature fluctuations. These materials feature a low coefficient of thermal expansion, self-lubricating properties, and enhanced thermal shock resistance, contributing to improved operational efficiency and increased production throughput。
Ultra-thin · High Strength · Low Thermal Expansion · High Insulation
Focusing on Si₃N₄ (Silicon Nitride) high-performance ceramic materials and ultra-thin precision substrates, providing high-reliability material solutions for semiconductor testing, precision electronics, and advanced packaging.
Ultra-thin Si₃N₄ Precision Substrate
Low CTE (Coefficient of Thermal Expansion), High Strength, High Heat Resistance, Excellent Insulation
Probe Card Substrate
Si₃N₄ Advanced Packaging Ceramic Core
Si₃N₄ is a high-performance engineering ceramic combining high mechanical strength, high fracture toughness, low thermal expansion, and high electrical insulation. It achieves an optimal balance among strength, toughness, thermal stability, and dimensional stability. These characteristics make it ideal for high-reliability semiconductor and precision electronic applications. Recent material research also identifies Si₃N₄ as a key material for high-reliability electronic substrates.
Utilizing high-performance silicon nitride (Si₃N₄) advanced structural ceramics, this solution features exceptional resistance to strong acid and alkali corrosion, an ultra-low coefficient of thermal expansion, and superior high-temperature mechanical strength. It thoroughly resolves common pain points of traditional metal screws in wafer fabrication equipment—such as susceptibility to corrosion, metal ion contamination, and high-temperature deformation or loosening—delivering the most stable and reliable fastening assurance for advanced manufacturing equipment.
1. Outstanding Chemical Resistance
Impervious to strong acids (e.g., HF, HNO₃, H₂SO₄), strong alkalis, and various chemical cleaning fluids. Ideally suited for semiconductor wet benches, cleaning, and etching equipment, guaranteeing no rust and no seizing over prolonged use.
2. Ultra-Low Thermal Expansion & High-Temperature Stability
Silicon nitride possesses an ultra-low coefficient of thermal expansion and high thermal shock resistance. It maintains dimensional stability under severe temperature fluctuations (cold-to-hot cycling) or high-temperature processing environments, preventing threads from loosening or fracturing due to thermal expansion and contraction.
3. High Cleanliness & Electrical Insulation (Prevents Metal Contamination)
The all-ceramic material completely eliminates the risk of metal ion contamination, satisfying the stringent cleanliness requirements of semiconductor fabs. Meanwhile, its excellent electrical insulation properties prevent equipment arcing and leakage interference.
4. High Mechanical Strength & Precision Threading
Boasting superior flexural strength and toughness among structural ceramics, it is manufactured using high-precision CNC ceramic machining technology. The smooth, precise thread profile offers high wear resistance and anti-galling characteristics, ensuring stability across repeated assembly and disassembly.
Infrared Thermal Imager / Blackbody Source (Laboratory Hot Plate/Blackbody Source) black square flat heating source. In scientific experiments requiring high-precision calibration, a precision heating plate coated with high emissivity coating is typically utilized for thermal diffusion testing. Using Fluke infrared thermal cameras, radiation energy emitted from the object is converted into visual images displaying real-time surface temperature values to observe the speed and state of heat radiation diffusion within the material.
This product utilizes a custom R&D formulation paired with AI-driven precise control over sintering temperatures and heating curves to ensure the polycrystalline structure achieves exceptional thermal conductivity. Combined with high-precision grinding and polishing processes, we deliver tailored thermal management solutions to meet specific customer requirements.
Core Advantages:
Ultra-Low Thermal Expansion: Remains stable without warping under high-temperature environments.
Superior Thermal Conduction: Delivers rapid and uniform thermal diffusion capabilities.
System Optimization: Through the architecture of "Heat Source → SiC Interlayer → Heat Dissipation Module", thermal conduction efficiency is maximized, making it the ideal thermal conductive medium for high-power components.
1. Ultra-High Thermal Conductivity (>170 W/m·K)
Break through the thermal bottlenecks of conventional copper/aluminum cooling modules. Its high thermal conductivity rapidly and uniformly transfers heat from core chips to the cooling medium, significantly lowering system thermal resistance and ensuring computing stability under heavy workloads.
2. Precision Micro-Channel Machining (High-Density Micro-Channels)
Featuring high-precision micro-channel structures, it drastically increases the effective contact area between the liquid coolant and the substrate. This design minimizes flow resistance while maximizing heat dissipation performance to tackle extreme high heat flux challenges.
3. Low Coefficient of Thermal Expansion (Excellent CTE Matching)
Silicon carbide exhibits an ultra-low CTE that closely matches silicon chips and wide-bandgap semiconductors (GaN/SiC). This effectively minimizes thermal stress damage caused by high-low temperature cycling, significantly extending module operational lifespan.
4. Superior Corrosion Resistance & High Mechanical Strength
Unlike metal substrates that are vulnerable to oxidation and corrosion, silicon carbide possesses exceptional chemical stability and hardness. It remains immune to long-term degradation from water or liquid coolants, making it ideal for harsh industrial environments and continuous long-term operations.
The White Light Interferometer (WLI) is a high-precision optical measurement technique capable of detecting the microscopic surface morphology of materials with nanometer-scale resolution。
When measuring the mirror-finished surfaces of high-density ceramic components, WLI can accurately capture surface micro-defects such as pits, scratches, and voids。
The SunRising Si₃N₄ / SiC composite was precisely polished to a mirror-finished surface and analyzed using White Light Interferometry (WLI). The scan results revealed a continuous and smooth surface, with no detectable pores or microcracks。
Thanks to WLI’s vertical resolution of up to 1 nm and lateral resolution of approximately 300 nm, any internal porosity connected to the surface would manifest as height variations in the interferometric image。
However, no such anomalies were observed during this test, indicating that the Si₃N₄ / SiC component possesses extremely low porosity, demonstrating a dense microstructure and high-quality fabrication。
Through WLI’s non-destructive inspection capabilities, we were able to quantify the surface uniformity and integrity of the ceramic material, providing a scientific basis for quality control and process optimization. The results confirm that this Si₃N₄ / SiC sample meets high-density standards, making it a reliable candidate for high-performance applications。
SGS Test Report!!SunRising Precision is a company that provides comprehensive product design and development services, with fast response and close collaboration as its features. SunRising Precision has a team of professional and talented engineers who provide customers with high-quality design and development services. SunRising Precision's successful cases include developing new components for well-known enterprises, improving product durability and reliability, and helping customers solve production bottlenecks and improve production efficiency. We are committed to helping customers achieve their goals.
White Light Interferometry (WLI)
Inspection Report
The hot-pressed sintered (HPSN) silicon carbide (SiC) material exhibits exceptionally high thermal conductivity, exceeding 160 W/(m·K), along with high hardness and excellent wear resistance. These characteristics make it ideal for thermal management components in high-performance computing systems, such as AI servers。 In addition, SiC features a high Young’s modulus and a low coefficient of thermal expansion (CTE), making it well-suited for applications requiring high dimensional precision and structural stability.
High-purity silicon carbide (SiC) exhibits high hardness, excellent wear resistance, and exceptionally high thermal conductivity, making it ideal for use in sliding components (such as mechanical seals) and thermal management elements in high-performance computing systems, including AI servers. In addition, it features a high Young’s modulus and a low coefficient of thermal expansion (CTE), making it well-suited for components requiring high dimensional precision and structural stability。
By utilizing ultrafine silicon nitride powder forming technology, we can produce materials that withstand rapid high-low temperature fluctuations, offering key advantages such as a low coefficient of thermal expansion and self-lubricating properties. These features contribute to improved operational efficiency and increased production throughput。
By leveraging the wear-resistant properties of high-purity nano powders, we provide an effective solution to severe scratching of filament guide components, which previously caused fibril defects and fiber dust generation during production. This advancement has successfully helped the chemical fiber industry increase production yield and efficiency.。
Isostatic hot-press sintering technology enables the production of high-density materials with excellent wear resistance and acid/alkali corrosion resistance. These materials exhibit outstanding mechanical properties and chemical stability, delivering significant performance advantages in industrial equipment and semiconductor applications。
Peel Strength Test：8.01 (lbf/in)
Solder Layer Thickness：0.5 μｍ
High-density copper-coated silicon nitride (Si₃N₄) is highly suitable for high-power and high-voltage PCB applications. The proprietary copper-coating process ensures excellent adhesion between the copper foil and the silicon nitride substrate, effectively eliminating delamination issues and significantly improving production yield for downstream processes。
Our silicon carbide (SiC), silicon nitride (Si₃N₄), and alumina ceramic materials are widely used in semiconductors, high-power communications, electric vehicles, energy systems, and aerospace sectors, helping customers enhance thermal management, wear resistance, and product reliability.
Key Customer Demands:
SiC thermal substrates, silicon nitride substrates, ceramic circuit boards
We specialize in supplying high-performance SiC thermal substrates (>170 W/m·K), Si₃N₄ ceramic substrates, and high-insulation circuit boards for use in semiconductor packaging, power modules, laser components, and 5G RF communications.
With properties such as high thermal conductivity, high temperature resistance, and low thermal expansion, our ceramic materials are the top choice for thermal and insulation solutions in power and microelectronic applications.
Key Customer Demands:
SiC heat sinks, Si₃N₄ PCBs, high thermal conductivity materials
To meet the high-performance thermal and insulation requirements of EV power modules, fast chargers, and automotive electronics, we offer high thermal conductivity SiC heat sinks, Si₃N₄ ceramic PCBs, and insulated substrates.
With excellent thermal conductivity from SiC and mechanical strength from Si₃N₄, our materials improve system efficiency and durability, supporting reliable automotive electronic performance.
Key Customer Demands:
SiC heat exchangers, thermal conductivity, corrosion-resistant ceramics
High thermal conductivity SiC (>170 W/m·K) and corrosion-resistant ceramic materials are widely used in energy and heat exchange systems, including reactors, heat sink modules, and high-temperature fluid systems.
Our hot-pressed SiC materials offer excellent thermal conductivity and acid-alkali resistance, making them suitable for extreme thermal and corrosive environments in solar, furnace, and chemical processing industries.
Key Customer Demands:
SiC bearings, molds, nozzles
We supply high-temperature resistant, wear-resistant SiC ceramic bearings, nozzles, and mold components for hot pressing machines, grinding equipment, and chemical pumps.
With high hardness, low friction, and chemical resistance, our Si₃N₄ composite ceramics offer mechanical strength and stability in extreme environments, ensuring high efficiency and longevity in processing equipment.
Key Customer Demands:
Lightweight high-temperature materials, Si₃N₄ ceramics
For extreme high-temperature and high-pressure environments, we provide specialized lightweight high-temperature ceramic materials for aerospace and defense, including high-strength SiC and Si₃N₄ structural components.
These materials offer excellent thermal shock resistance, compressive strength, and low thermal expansion—ideal for engine protection parts, thermal shields, guidewire systems, and durable bearings.
Key Customer Demands:
Hot-press sintering, precision ceramic machining, ceramic substrates
We offer hot-press sintering and precision ceramic machining services, focusing on high-hardness materials such as SiC, Si₃N₄, and Al₂O₃. Applications include ceramic substrates, wire guides, mold sleeves, and precision nozzles.
From raw material selection to final machining, we ensure high dimensional accuracy and wear resistance standards.
SunRising is a company composed of talented materials composite design engineers from diverse cultural backgrounds.
The SunRising team possesses rich experience in silicon nitride composite materials and is committed to developing innovative and advanced component solutions to assist customers in overcoming complex technical challenges.
Customer needs are our top priority, and we provide the best products and services through close collaboration with them to ensure their satisfaction and competitiveness.
With the support of SunRising's expertise in material composite design, we believe we can bring excellent value to our customers.
Learn MoreThe special-grade silicon nitride (Si₃N₄) demonstrates excellent resistance to rapid temperature fluctuations, delivering outstanding durability and reliability for consistent performance in harsh industrial environments。
High-density silicon nitride (Si₃N₄) offers a combination of outstanding thermal and mechanical properties, making it ideal for demanding industrial applications.
By utilizing ultrafine silicon nitride powder forming technology, this material is engineered to withstand rapid temperature fluctuations between high and low extremes. It also features a low coefficient of thermal expansion and self-lubricating properties, which contribute to:
✅Enhanced operational efficiency
✅Reduced wear and maintenance
✅Increased production throughput
These characteristics make high-density Si₃N₄ a reliable and high-performance ceramic solution for advanced manufacturing environments.
Special-grade silicon carbide (SiC) exhibits excellent resistance to rapid temperature fluctuations, delivering exceptional durability and stable performance under harsh industrial conditions。
By utilizing ultrafine silicon carbide (SiC) powder forming technology, we are able to produce materials that withstand rapid high-low temperature fluctuations. These materials offer key advantages such as a low coefficient of thermal expansion and self-lubricating properties, contributing to improved efficiency and increased production throughput。
The special-grade electrically conductive silicon nitride (Si₃N₄) material exhibits non-stick behavior and zero residue even in complex operating environments. It demonstrates outstanding durability and reliability, ensuring stable performance under harsh industrial conditions。
By utilizing ultrafine silicon nitride powder forming technology, we can produce materials capable of withstanding rapid temperature fluctuations between high and low extremes. These materials offer key advantages such as a low coefficient of thermal expansion and self-lubricating properties, which contribute to enhanced operational efficiency and increased production throughput。
High-density silicon nitride coated copper is highly suitable for high power and high voltage printed circuit board (PCBs) requirements. Its unique copper coating process can achieve perfect bonding between copper foil and silicon nitride PCBs, solving the problem of delamination and successfully improving the yield of customer-side processes.
Capable of withstanding peel strength test data up to: Tensile Strength (lbf/in) 8.01
Nitride Silicon printed circuit board (PCBs) have high hardness and strength, good thermal conductivity, low coefficient of thermal expansion, low creep at high temperatures, oxidation resistance, corrosion resistance, low coefficient of friction, and are a ceramic material with excellent overall performance.
Aluminum oxide is a typical amphoteric oxide, appearing as a white solid insoluble in water, with high mechanical strength, non-toxicity, odorlessness, and insolubility in non-polar organic solvents such as water and ethanol. Due to its slight solubility in acids and bases, and ability to dissolve in inorganic acids and alkaline solutions, aluminum oxide plays an important role in chemical reactions. In addition, aluminum oxide has a relative density of 4.0 and a high melting point of 2050℃, with high temperature stability.
Alumina ceramic is a high-tech ceramic product with excellent performance, which emerged in the ceramic industry due to its comprehensive technical advantages. Alumina ceramic has excellent mechanical strength, high hardness, low high-frequency dielectric loss, high temperature insulation resistance, chemical corrosion resistance, and good thermal conductivity. In addition, alumina ceramic has uniform particle size, smooth surface, and appears as white spherical porous particles, so it can be applied in various industrial fields.
Using silicon nitride ultrafine powder forming technology, materials with high and low temperature instant differential tolerance can be produced, which has the advantages of low thermal expansion coefficient and self-lubrication, and can improve efficiency and increase production capacity.
SunRising Precision's products are made of high-quality raw materials and are ensured for their high quality and stability through precise processing technology and strict quality control procedures. Our professional team can provide personalized solutions to meet the different needs and requirements of our customers. Whether you need materials for high-temperature and high-pressure environments, special materials for extreme environments, or customized products with special shapes and sizes, SunRising Precision can provide you with the highest quality products and services. SunRising Precision is committed to providing customers with the best materials to help them maximize their value and achieve greater success in various industries.