Densification Analysis!White Light Interferometry (WLI) Inspection Report

A5-3-3-1

The White Light Interferometer (WLI) is a high-precision optical measurement technique capable of detecting the microscopic surface morphology of materials with nanometer-scale resolution。

When measuring the mirror-finished surfaces of high-density ceramic components, WLI can accurately capture surface micro-defects such as pits, scratches, and voids。

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WhiteLight

The SunRising Si₃N₄ / SiC composite was precisely polished to a mirror-finished surface and analyzed using White Light Interferometry (WLI). The scan results revealed a continuous and smooth surface, with no detectable pores or microcracks

Thanks to WLI’s vertical resolution of up to 1 nm and lateral resolution of approximately 300 nm, any internal porosity connected to the surface would manifest as height variations in the interferometric image

However, no such anomalies were observed during this test, indicating that the Si₃N₄ / SiC component possesses extremely low porosity, demonstrating a dense microstructure and high-quality fabrication

Through WLI’s non-destructive inspection capabilities, we were able to quantify the surface uniformity and integrity of the ceramic material, providing a scientific basis for quality control and process optimization. The results confirm that this Si₃N₄ / SiC sample meets high-density standards, making it a reliable candidate for high-performance applications

SGS Test Report!!

Service

SunRising Precision is a company that provides comprehensive product design and development services, with fast response and close collaboration as its features. SunRising Precision has a team of professional and talented engineers who provide customers with high-quality design and development services. SunRising Precision's successful cases include developing new components for well-known enterprises, improving product durability and reliability, and helping customers solve production bottlenecks and improve production efficiency. We are committed to helping customers achieve their goals.

High-Thermal-Conductivity Silicon Carbide (SiC) HPSN Heat-Sinking Engineering

White Light Interferometry (WLI)
Inspection Report

The hot-pressed sintered (HPSN) silicon carbide (SiC) material exhibits exceptionally high thermal conductivity, exceeding 160 W/(m·K), along with high hardness and excellent wear resistance. These characteristics make it ideal for thermal management components in high-performance computing systems, such as AI servers。 In addition, SiC features a high Young’s modulus and a low coefficient of thermal expansion (CTE), making it well-suited for applications requiring high dimensional precision and structural stability.

SGS Report

Hot-Pressed Sintered Silicon Nitride (HPSN) Precision Engineering

Rapid Thermal Cycling Test

High-purity silicon carbide (SiC) exhibits high hardness, excellent wear resistance, and exceptionally high thermal conductivity, making it ideal for use in sliding components (such as mechanical seals) and thermal management elements in high-performance computing systems, including AI servers. In addition, it features a high Young’s modulus and a low coefficient of thermal expansion (CTE), making it well-suited for components requiring high dimensional precision and structural stability。

Hot-Pressed Sintered Silicon Nitride (Si₃N₄, HPSN) for Optoelectronic Applications

By utilizing ultrafine silicon nitride powder forming technology, we can produce materials that withstand rapid high-low temperature fluctuations, offering key advantages such as a low coefficient of thermal expansion and self-lubricating properties. These features contribute to improved operational efficiency and increased production throughput。

High Wear-Resistant Alumina (Al₂O₃) Material

Factory Test Report

By leveraging the wear-resistant properties of high-purity nano powders, we provide an effective solution to severe scratching of filament guide components, which previously caused fibril defects and fiber dust generation during production. This advancement has successfully helped the chemical fiber industry increase production yield and efficiency.。



Precision Engineering with Hot-Pressed Sintered Silicon Nitride (Si₃N₄, HPSN)

Isostatic hot-press sintering technology enables the production of high-density materials with excellent wear resistance and acid/alkali corrosion resistance. These materials exhibit outstanding mechanical properties and chemical stability, delivering significant performance advantages in industrial equipment and semiconductor applications。

Silicon Nitride (Si₃N₄) with Copper/Gold Coating

Peel Strength Test:8.01 (lbf/in)

Solder Layer Thickness:0.5 μm

High-density copper-coated silicon nitride (Si₃N₄) is highly suitable for high-power and high-voltage PCB applications. The proprietary copper-coating process ensures excellent adhesion between the copper foil and the silicon nitride substrate, effectively eliminating delamination issues and significantly improving production yield for downstream processes。

Industrial Solutions and Expertise in High-Performance Ceramics

Our silicon carbide (SiC), silicon nitride (Si₃N₄), and alumina ceramic materials are widely used in semiconductors, high-power communications, electric vehicles, energy systems, and aerospace sectors, helping customers enhance thermal management, wear resistance, and product reliability.

Electronics & Semiconductors

Key Customer Demands:

SiC thermal substrates, silicon nitride substrates, ceramic circuit boards

We specialize in supplying high-performance SiC thermal substrates (>170 W/m·K), Si₃N₄ ceramic substrates, and high-insulation circuit boards for use in semiconductor packaging, power modules, laser components, and 5G RF communications.
With properties such as high thermal conductivity, high temperature resistance, and low thermal expansion, our ceramic materials are the top choice for thermal and insulation solutions in power and microelectronic applications.

Automotive & Electric Vehicles

Key Customer Demands:

SiC heat sinks, Si₃N₄ PCBs, high thermal conductivity materials

To meet the high-performance thermal and insulation requirements of EV power modules, fast chargers, and automotive electronics, we offer high thermal conductivity SiC heat sinks, Si₃N₄ ceramic PCBs, and insulated substrates.
With excellent thermal conductivity from SiC and mechanical strength from Si₃N₄, our materials improve system efficiency and durability, supporting reliable automotive electronic performance.

Energy & Thermal Systems

Key Customer Demands:

SiC heat exchangers, thermal conductivity, corrosion-resistant ceramics

High thermal conductivity SiC (>170 W/m·K) and corrosion-resistant ceramic materials are widely used in energy and heat exchange systems, including reactors, heat sink modules, and high-temperature fluid systems.
Our hot-pressed SiC materials offer excellent thermal conductivity and acid-alkali resistance, making them suitable for extreme thermal and corrosive environments in solar, furnace, and chemical processing industries.

Industrial & Machinery Equipment

Key Customer Demands:

SiC bearings, molds, nozzles

We supply high-temperature resistant, wear-resistant SiC ceramic bearings, nozzles, and mold components for hot pressing machines, grinding equipment, and chemical pumps.
With high hardness, low friction, and chemical resistance, our Si₃N₄ composite ceramics offer mechanical strength and stability in extreme environments, ensuring high efficiency and longevity in processing equipment.



Aerospace & Defense

Key Customer Demands:

Lightweight high-temperature materials, Si₃N₄ ceramics

For extreme high-temperature and high-pressure environments, we provide specialized lightweight high-temperature ceramic materials for aerospace and defense, including high-strength SiC and Si₃N₄ structural components.
These materials offer excellent thermal shock resistance, compressive strength, and low thermal expansion—ideal for engine protection parts, thermal shields, guidewire systems, and durable bearings.

Ceramics & Precision Machining

Key Customer Demands:

Hot-press sintering, precision ceramic machining, ceramic substrates

We offer hot-press sintering and precision ceramic machining services, focusing on high-hardness materials such as SiC, Si₃N₄, and Al₂O₃. Applications include ceramic substrates, wire guides, mold sleeves, and precision nozzles.
From raw material selection to final machining, we ensure high dimensional accuracy and wear resistance standards.

About SunRising

SunRising is a company composed of talented materials composite design engineers from diverse cultural backgrounds.

The SunRising team possesses rich experience in silicon nitride composite materials and is committed to developing innovative and advanced component solutions to assist customers in overcoming complex technical challenges.

Customer needs are our top priority, and we provide the best products and services through close collaboration with them to ensure their satisfaction and competitiveness.

With the support of SunRising's expertise in material composite design, we believe we can bring excellent value to our customers.

Learn More

Machinable Silicon Nitride (Si₃N₄) Ceramic Material

The special-grade silicon nitride (Si₃N₄) demonstrates excellent resistance to rapid temperature fluctuations, delivering outstanding durability and reliability for consistent performance in harsh industrial environments。

Machinable Silicon Carbide (SiC) Ceramic Material

Special-grade silicon carbide (SiC) exhibits excellent resistance to rapid temperature fluctuations, delivering exceptional durability and stable performance under harsh industrial conditions。

Machinable Electrically Conductive Silicon Nitride (Si₃N₄) Ceramic Material

The special-grade electrically conductive silicon nitride (Si₃N₄) material exhibits non-stick behavior and zero residue even in complex operating environments. It demonstrates outstanding durability and reliability, ensuring stable performance under harsh industrial conditions。

Silicon Nitride PCBs Copper Cladding Silicon Nitride (Si3N4)

  • 01 What are the features of high-density Si3N4 copper clad?

    High-density silicon nitride coated copper is highly suitable for high power and high voltage printed circuit board (PCBs) requirements. Its unique copper coating process can achieve perfect bonding between copper foil and silicon nitride PCBs, solving the problem of delamination and successfully improving the yield of customer-side processes.

    Capable of withstanding peel strength test data up to: Tensile Strength (lbf/in) 8.01

  • 02 What are the advantages of high-density silicon nitride (Si3N4)?

    Nitride Silicon printed circuit board (PCBs) have high hardness and strength, good thermal conductivity, low coefficient of thermal expansion, low creep at high temperatures, oxidation resistance, corrosion resistance, low coefficient of friction, and are a ceramic material with excellent overall performance.

  • 03Is the copper plating successful?
 

High wear-resistant material of aluminum oxide Al2O3 (99.5%)

 

Special material of silicon nitride Si3N4

 

Contact SunRising

SunRising Precision's products are made of high-quality raw materials and are ensured for their high quality and stability through precise processing technology and strict quality control procedures. Our professional team can provide personalized solutions to meet the different needs and requirements of our customers. Whether you need materials for high-temperature and high-pressure environments, special materials for extreme environments, or customized products with special shapes and sizes, SunRising Precision can provide you with the highest quality products and services. SunRising Precision is committed to providing customers with the best materials to help them maximize their value and achieve greater success in various industries.

Email:apache.golf@msa.hinet.net
Call:+886 952579450
Phone: +886 49 2247483
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