We specialize in supplying high-performance SiC thermal substrates (>170 W/m·K), Si₃N₄ ceramic substrates, and high-insulation circuit boards for use in semiconductor packaging, power modules, laser components, and 5G RF communications.
With properties such as high thermal conductivity, high temperature resistance, and low thermal expansion, our ceramic materials are the top choice for thermal and insulation solutions in power and microelectronic applications.
