Silicon Nitride (Si3N4) printed circuit board (PCBs) coated with gold (full cover)
- Fields：
- １、Electric vehicles
- ２、Wind power generation
- ３、High voltage high power
- ４、Power electronics
Silicon Nitride (Si3N4) printed circuit board (PCBs) coated with gold (full cover)
High-density silicon nitride gold-clad laminates are highly suitable for high-power and high-voltage circuit board requirements. The unique gold-clad process enables the perfect bonding of copper foil to silicon nitride substrate, effectively preventing delamination and significantly improving the yield rate of customer-side processes.
Nitride ceramic substrate has high hardness and strength, good thermal conductivity, low coefficient of thermal expansion, low high-temperature creep, resistance to oxidation and corrosion, low friction coefficient, and is a ceramic material with excellent comprehensive performance.
Technical specifications of silicon nitride Si3N4 PCBs.
| Item | Unit | Test Standard |
|---|---|---|
| colour | ivory | |
| Density | g/cm3 | 3.2 |
| Flexural Strength | Mpa | >800 |
| Camber | Length% | ≦3 |
| Thermal Conductivity | 25∘C,W/(m.k) | >80 |
| Coefficient of thermal expansion |
10-6/K (40-400∘C)
10-6/K (40-800∘C) |
2.0-3.0
2.0-3.0 |
| Dielectric Constant | KV/mm | ≧17 |
| Volume resistance | ≧1014 |
AMB copper-clad silicon nitride Si3N4 circuit board
| Item | Unit | Test Standard |
|---|---|---|
| PlatingTemperature resistance characteristics | Customized thickness of copper clad plating | 410±10℃，5min |
| Solder maskTemperature resistance characteristics | 320℃, 60sec | |
| Temperature shock | (0.32mm Si3N4/0.3Cu，無孔-40℃~150℃、Transfer time＜30min；＞3000 | |
| Surface roughnes | μm | Ra≤1.5μm |
| Peeling strength | N/mm | （50mm/min） |
| Solder wettability | % | ≥95（Sn/0.7Cu） |
| Void content (C-SAM) | ≤3% |
Product specifications
| Item | Unit | Test Standard |
|---|---|---|
| Thickness |
0.254 mm 0.32 mm 0.635 mm 1.0 mm |
|
| Length and Width |
114.3*114.3 mm 138*190 mm |