Silicon Nitride (Si3N4) printed circuit board (PCBs) coated with copper
High-density silicon nitride coated with copper is highly suitable for high-power and high-voltage circuit board requirements.Our unique copper plating process enables perfect adhesion of copper foil to the silicon nitride substrate, eliminating the issue of delamination. This highly specialized process greatly improves the production yield and quality of our customers' high-power and high-voltage circuit board needs.
According to instrument testing, the copper plating withstands a peel strength test with a force of 8.01 (lbf/in), exceeding the minimum requirement specified by IPC standards.
Utilizing advanced copper plating technology with a solder thickness of 0.5 μm
