Silicon Nitride Copper Cladding
Silicon Nitride Copper Cladding

Silicon Nitride Copper Cladding

  • Fields：
  • １、Electric vehicles
  • ２、Wind power generation
  • ３、High voltage high power
  • ４、Power electronics

Silicon Nitride (Si3N4) printed circuit board (PCBs) coated with copper

High-density silicon nitride copper-clad laminates are highly suitable for high-power and high-voltage circuit board requirements. The unique copper-clad process enables the perfect bonding of copper foil to silicon nitride substrate, effectively preventing delamination and significantly improving the yield rate of customer-side processes.

Nitride ceramic substrate has high hardness and strength, good thermal conductivity, low coefficient of thermal expansion, low high-temperature creep, resistance to oxidation and corrosion, low friction coefficient, and is a ceramic material with excellent comprehensive performance.

Silicon Nitride (Si3N4) PCBs with Copper Cladding Testing

Tested with instruments: Copper-clad material withstands peel strength test with data reaching: Tensile Strength (lbf/in) 8.01



Technical specifications of silicon nitride Si3N4 PCBs.

Item Unit Test Standard
colour ivory
Density g/cm3 3.2
Flexural Strength Mpa >800
Camber Length% ≦3
Thermal Conductivity 25∘C,W/(m.k) >80
Coefficient of thermal expansion 10-6/K (40-400∘C)
10-6/K (40-800∘C) 		2.0-3.0
2.0-3.0
Dielectric Constant KV/mm ≧17
Volume resistance ≧1014


AMB copper-clad silicon nitride Si3N4 circuit board

Item Unit Test Standard
PlatingTemperature resistance characteristics Customized thickness of copper clad plating 410±10℃，5min
Solder maskTemperature resistance characteristics 320℃, 60sec
Temperature shock (0.32mm Si3N4/0.3Cu，無孔-40℃~150℃、Transfer time＜30min；＞3000
Surface roughnes μm Ra≤1.5μm
Peeling strength N/mm （50mm/min）
Solder wettability % ≥95（Sn/0.7Cu）
Void content (C-SAM) ≤3%


Product specifications

Item Unit Test Standard
Thickness 0.254 mm
0.32 mm
0.635 mm
1.0 mm
Length and Width 114.3*114.3 mm
138*190 mm