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Xu Zheng Advanced Precision【High-Performance Sintered Polycrystalline Silicon Carbide (SiC)】The Perfect Combination of Ultimate Thermal Conductivity and Thermal Stability! High Thermal Conductivity Sintered Polycrystalline Silicon Carbide SiC Thermal Diffusion Test Report

Xu Zheng Advanced Precision - White Light Interferometry (WLI) Test Report

Infrared Thermal Camera / Blackbody Radiation Source (Laboratory Hot Plate / Blackbody Source) black square flat heating source. In scientific experiments, for ultra-high precision calibration during general thermal diffusion tests, this is typically a precision electric heating plate coated with high emissivity. Using an infrared camera produced by Fluke, infrared energy emitted by objects can be converted into visual images, displaying real-time surface temperature values at various points to observe the speed and status of thermal radiation diffusion within the material.

We optimized the sintering curve through AI technology, enabling silicon carbide to demonstrate astonishing thermal conductivity performance. It not only withstands high temperatures and has low thermal expansion, but also ensures the physical structure remains stable without warping or deformation under high thermal loads.

Field test results prove: Thermal diffusion is fast and uniformly distributed (as shown in the figure). Applying it as an interface layer between the "heat source and heat dissipation materials" significantly improves the overall system's thermal management efficiency.


Xu Zheng Advanced Precision - White Light Interferometry (WLI) Test Report Si3N4_circle

Thermal Diffusion Image of Standard Commercial Materials

Xu Zheng Advanced Precision - White Light Interferometry (WLI) Test Report Si3N4_circle

Xu Zheng SiC Uniform High-Speed Conduction Image


High-Conduction Xu Zheng SiC Heat Dissipation Module

When measuring mirror surfaces of high-density ceramic components, WLI can accurately capture surface micro-defects such as pits, scratches, or pores.
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Xu Zheng SiC Heat Dissipation Module



Xu Zheng Si3N4 / SiC has been finely polished to a mirror finish. Scanning analysis using WLI reveals that the surface is continuous and smooth, with no pores or micro-cracks detected.

Because WLI offers a vertical resolution down to 1 nm and a lateral resolution down to 300 nm, any internal pores connected to the surface would manifest as height variations in the interferogram.

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Xu Zheng SiC Heat Dissipation Module Test Image





Technical Specifications for High Thermal Conductivity Silicon Carbide (SiC) Material

Spec Unit Test Standard / Value
Purity % ≧ 98.5
Density g/cm3 3.16
Mohs Hardness CNS3299:2006 9
Flexural Strength MPa (ASTM D790-17) 337
Thermal Conductivity W/(m·K) ≧ 170
Electrical Resistivity (Ω) 500 V/sec ( JIS K6911:1995 ) ≧ 4.34 x 107
Coefficient of Thermal Expansion 23~200 °C (ASTM E831-19) 3.266 x 10-6
Coefficient of Thermal Expansion 23~500 °C (ASTM E831-19) 3.913 x 10-6