Precision engineering materials of silicon nitride
Hot pressing, wear-resistant, acid and alkali-resistant, and free of pinholes.
- Fields:
- 1、Semiconductor equipment
- 2、mold
- 3、tooling machine
Precision engineering materials of silicon nitride
The isostatic hot pressing sintering technology of silicon nitride is an important material forming method that can produce high-density, wear-resistant, and corrosion-resistant materials with excellent mechanical properties and chemical stability. Under high temperature and high pressure conditions, the material particles are tightly combined, eliminating pores and cracks. Materials produced with this technology have uniform texture, excellent mechanical properties, strong wear resistance, and good corrosion resistance, thus greatly improving the density and hardness of critical components in mechanical parts, wear-resistant parts, and conveyor systems, increasing the equipment's lifespan and stability, reducing maintenance costs, and improving production efficiency. It is widely used in industrial equipment and semiconductor industries, among other fields.
Technical specifications of silicon nitride Si3N4 material.
Item | Unit | Test Standard |
---|---|---|
Density | g/cm3 | 3.2 |
Elastic Modulus | Gpa | 300 |
Coefficient of thermal | 10-6K-1 | 3.2 |
hardness (HV) | Mpa | 1600 |
Fracture toughnes | Mpa | 7.0 |
Flexural Strength (room temperature) | Mpa | 720 |
Flexural Strength (700℃) | Mpa | 450 |
Bending strength (room temperature) | Mpa | 2500 |
松柏比 | 0.25 | |
Thermal conductivity | (mk)-1 | 20 |
specific resistivity | ≥1015 | |
Maximum operating temperature (no load) | ℃ | 1100 |
Acid and alkali corrosion resistance | strong |